Here are two photos relating to various aspects
of Mr. Kleppinger’s early transistor work at RCA. The top photo shows a display developed by Rob which
illustrates his work in the mid to late 1960s with Dow Corning to implement
plastic transistor packages. In this case, the packaging process for the
TA-7035 Dual Gate MOS transistor is shown.
This plastic process was also used successfully for early IC’s. The photo on the right shows a rubber
mold used in the mid 1950s at the Rca Harrison facility to encapsulate
germanium transistors in epoxy packages.
This was a very labor intensive process, and was only used in the
first two or three years of transistor development. Shown next to the mold is a 2N41 hearing
aid transistor which was encapsulated using the mold. According to Rob, the very first Rca
junction transistors (TA-153) used a similar mold and process.